Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

Show simple item record
dc.contributor.authorKalaš, David
dc.contributor.authorSoukup, Radek
dc.contributor.authorŘeboun, Jan
dc.contributor.authorRadouchová, Michaela
dc.contributor.authorRous, Pavel
dc.contributor.authorHamáček, Aleš
dc.date.accessioned2023-07-24T10:00:18Z
dc.date.available2023-07-24T10:00:18Z
dc.date.issued2023
dc.description.abstract-translatedNowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits still depend upon the use of semiconductor components or integrated circuits, which cannot be currently implemented directly into the textiles or substituted by functionalized yarns. This study is focused on a novel thermo-compression interconnection technique intended for the realization of the electrical interconnection of SMD components or modules with textile substrates and their encapsulation in one single production step using commonly widespread cost-effective devices, such as 3D printers and heat-press machines, intended for textile applications. The realized specimens are characterized by low resistance (median 21 mW), linear voltage–current characteristics, and fluid-resistant encapsulation. The contact area is comprehensively analyzed and compared with the theoretical Holm’s model.en
dc.format21 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationKALAŠ, D. SOUKUP, R. ŘEBOUN, J. RADOUCHOVÁ, M. ROUS, P. HAMÁČEK, A. Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials. Polymers, 2023, roč. 15, č. 11, s. nestránkováno. ISSN: 2073-4360cs
dc.identifier.document-number1006301400001
dc.identifier.doi10.3390/polym15112526
dc.identifier.issn2073-4360
dc.identifier.obd43939779
dc.identifier.uri2-s2.0-85161539050
dc.identifier.urihttp://hdl.handle.net/11025/53040
dc.language.isoenen
dc.project.IDTN02000067/Nové směry v elektronice pro průmysl 4.0 a medicínu 4.0 (FEIM)_Senzory a systémy pro Healthcarecs
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
dc.publisherMDPIen
dc.relation.ispartofseriesPolymerscs
dc.rights© The Author(s)en
dc.rights.accessopenAccessen
dc.subject.translatedinterconnection techniqueen
dc.subject.translatedencapsulationen
dc.subject.translatede-textileen
dc.subject.translated3D printingen
dc.titleNovel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materialsen
dc.typečlánekcs
dc.typearticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

Files

Original bundle
Showing 1 - 1 out of 1 results
No Thumbnail Available
Name:
Kalas_polymers-15-02526-v2.pdf
Size:
7.73 MB
Format:
Adobe Portable Document Format
Download

Collections

Articles (KET)
 Articles (RICE)