Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials
Date issued
2023
Journal Title
Journal ISSN
Volume Title
Publisher
MDPI
Abstract
Description
Subject(s)
Citation
KALAŠ, D. SOUKUP, R. ŘEBOUN, J. RADOUCHOVÁ, M. ROUS, P. HAMÁČEK, A. Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials. Polymers, 2023, roč. 15, č. 11, s. nestránkováno. ISSN: 2073-4360