Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials

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KALAŠ, D. SOUKUP, R. ŘEBOUN, J. RADOUCHOVÁ, M. ROUS, P. HAMÁČEK, A. Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials. Polymers, 2023, roč. 15, č. 11, s. nestránkováno. ISSN: 2073-4360