Study of copper thick film metallization on aluminum nitride
Date issued
2020
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Publisher
Elsevier
Abstract
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Citation
HLÍNA, J., ŘEBOUN, J., HAMÁČEK, A. Study of copper thick film metallization on aluminum nitride. Scripta materialia, 2020, roč. 176, č. February 2020, s. 23-27. ISSN 1359-6462.