Study of copper thick film metallization on aluminum nitride

Date issued

2020

Journal Title

Journal ISSN

Volume Title

Publisher

Elsevier

Abstract

Description

Subject(s)

Citation

HLÍNA, J., ŘEBOUN, J., HAMÁČEK, A. Study of copper thick film metallization on aluminum nitride. Scripta materialia, 2020, roč. 176, č. February 2020, s. 23-27. ISSN 1359-6462.
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