Properties of thick printed copper films on alumina substrates
| dc.contributor.author | Hlína, Jiří | |
| dc.contributor.author | Řeboun, Jan | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.date.accessioned | 2020-03-02T11:00:24Z | |
| dc.date.available | 2020-03-02T11:00:24Z | |
| dc.date.issued | 2019 | |
| dc.description.abstract-translated | This paper is focused on the properties of Thick Printed Copper (TPC) films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on electrical, mechanical and thermal properties of these films. The changes of these properties depending on the thickness of TPC films are described in this paper. | en |
| dc.format | 5 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | HLÍNA, J., ŘEBOUN, J., HAMÁČEK, A. Properties of thick printed copper films on alumina substrates. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-5. ISBN 978-1-7281-1874-1 , ISSN 2161-2528. | en |
| dc.identifier.document-number | 507501000049 | |
| dc.identifier.doi | 10.1109/ISSE.2019.8810277 | |
| dc.identifier.isbn | 978-1-7281-1874-1 | |
| dc.identifier.issn | 2161-2528 | |
| dc.identifier.obd | 43926596 | |
| dc.identifier.uri | 2-s2.0-85072295975 | |
| dc.identifier.uri | http://hdl.handle.net/11025/36553 | |
| dc.language.iso | en | en |
| dc.project.ID | EF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligence | cs |
| dc.project.ID | FV20140/Pokročilý materiálový systém pro výrobu chytré výkonové elektroniky ADMAT | cs |
| dc.project.ID | SGS-2018-016/Diagnostika a materi�ly v elektrotechnice | cs |
| dc.publisher | IEEE | en |
| dc.relation.ispartofseries | 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/ | en |
| dc.rights | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. | cs |
| dc.rights | © IEEE | en |
| dc.rights.access | restrictedAccess | en |
| dc.subject.translated | alumina | en |
| dc.subject.translated | thick film | en |
| dc.subject.translated | electrical parameters | en |
| dc.subject.translated | copper | en |
| dc.title | Properties of thick printed copper films on alumina substrates | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |