Properties of thick printed copper films on alumina substrates
Date issued
2019
Authors
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Journal ISSN
Volume Title
Publisher
IEEE
Abstract
Description
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Citation
HLÍNA, J., ŘEBOUN, J., HAMÁČEK, A. Properties of thick printed copper films on alumina substrates. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-5. ISBN 978-1-7281-1874-1 , ISSN 2161-2528.