Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys

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dc.contributor.authorRous, Pavel
dc.contributor.authorPřibek, Petr
dc.contributor.authorSteiner, František
dc.date.accessioned2022-12-05T11:00:18Z
dc.date.available2022-12-05T11:00:18Z
dc.date.issued2022
dc.description.abstract-translatedThis article will present the influence of thermal aging and the reflow cycle numbers on intermetallic layer growth. Search for the new soldering alloy brings a new and different combination of elements, which behave differently in work conditions. The objects of the experiment are five types of solder alloys, the referential alloy is SAC compared to SnNi based solder alloys combined with germanium, cobalt, phosphor, and copper elements. The results of the experiment will be the thickness of intermetallic layers between the copper pad and solder alloys in different combinations of thermal aging and reflow cycles. Values will be supported by the elemental analysis by the electron microscope using an EDS (Energy-dispersive X-ray spectroscopy) analysis. More details about the solder alloys and settings reflow and aging processes will be presented in the paper.en
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationROUS, P. PŘIBEK, P. STEINER, F. Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys. In Proceedings of the 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : CDEE 2022. Pilsen: University of West Bohemia in Pilsen, 2022. s. nestránkováno. ISBN: 978-1-66548-082-6cs
dc.identifier.doi10.1109/Diagnostika55131.2022.9905224
dc.identifier.isbn978-1-66548-082-6
dc.identifier.obd43937049
dc.identifier.uri2-s2.0-85141358676
dc.identifier.urihttp://hdl.handle.net/11025/50539
dc.language.isoenen
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
dc.project.IDEF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligencecs
dc.publisherUniversity of West Bohemia in Pilsenen
dc.relation.ispartofseriesProceedings of the 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : CDEE 2022en
dc.rights© IEEEen
dc.rights.accessopenAccessen
dc.subject.translatedintermetallic compounden
dc.subject.translatedintermetallic layersen
dc.subject.translatedsolder alloyen
dc.subject.translatedthermal agingen
dc.subject.translatedreflow solderingen
dc.titleInfluence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloysen
dc.typekonferenční příspěvekcs
dc.typeConferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

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