Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys
Date issued
2022
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Publisher
University of West Bohemia in Pilsen
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Citation
ROUS, P. PŘIBEK, P. STEINER, F. Influence Of Thermal Aging On Intermetallic Compound Growth In Solder Alloys. In Proceedings of the 2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : CDEE 2022. Pilsen: University of West Bohemia in Pilsen, 2022. s. nestránkováno. ISBN: 978-1-66548-082-6