Copper-filled vias made by thick printed copper technology
| dc.contributor.author | Hlína, Jiří | |
| dc.contributor.author | Řeboun, Jan | |
| dc.contributor.author | Michal, David | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.date.accessioned | 2021-03-08T11:00:18Z | |
| dc.date.available | 2021-03-08T11:00:18Z | |
| dc.date.issued | 2020 | |
| dc.description.abstract-translated | This paper is focused on copper-filled vias realized by prospective Thick Printed Copper (TPC) technology. TPC technology can be used for power electronics substrate manufacturing instead of conventional metallization techniques (DBC or AMB). This technology enables the realization of complex interconnection including multilayer circuits and copper-filled vias. Process of realization and properties of copper-plated vias are described in detail in this paper. | en |
| dc.format | 4 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | HLÍNA, J. ŘEBOUN, J. MICHAL, D. HAMÁČEK, A. Copper-filled vias made by thick printed copper technology. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscaway: IEEE, 2020. s. 1-4. ISBN 978-1-72816-773-2. | cs |
| dc.identifier.doi | 10.1109/ISSE49702.2020.9121024 | |
| dc.identifier.isbn | 978-1-72816-773-2 | |
| dc.identifier.obd | 43929753 | |
| dc.identifier.uri | 2-s2.0-85087613754 | |
| dc.identifier.uri | http://hdl.handle.net/11025/42797 | |
| dc.language.iso | en | en |
| dc.project.ID | EF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligence | cs |
| dc.project.ID | SGS-2018-016/Diagnostika a materiály v elektrotechnice | cs |
| dc.publisher | IEEE | en |
| dc.relation.ispartofseries | Proceedings of the 2020 30th International Conference Radioelektronika, RADIOELEKTRONIKA 2020 | en |
| dc.rights | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. | cs |
| dc.rights | © IEEE | en |
| dc.rights.access | restrictedAccess | en |
| dc.subject.translated | copper alloys | en |
| dc.subject.translated | ink jet printing | en |
| dc.subject.translated | interconnections | en |
| dc.subject.translated | soldering | en |
| dc.subject.translated | vias | en |
| dc.title | Copper-filled vias made by thick printed copper technology | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |