Copper-filled vias made by thick printed copper technology

Date issued

2020

Journal Title

Journal ISSN

Volume Title

Publisher

IEEE

Abstract

Description

Subject(s)

Citation

HLÍNA, J. ŘEBOUN, J. MICHAL, D. HAMÁČEK, A. Copper-filled vias made by thick printed copper technology. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscaway: IEEE, 2020. s. 1-4. ISBN 978-1-72816-773-2.
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