Copper-filled vias made by thick printed copper technology
Date issued
2020
Journal Title
Journal ISSN
Volume Title
Publisher
IEEE
Abstract
Description
Subject(s)
Citation
HLÍNA, J. ŘEBOUN, J. MICHAL, D. HAMÁČEK, A. Copper-filled vias made by thick printed copper technology. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscaway: IEEE, 2020. s. 1-4. ISBN 978-1-72816-773-2.