Determination of cohesive parameters for mode I of epoxy adhesive
| dc.contributor.author | Kalina, Tomáš | |
| dc.contributor.author | Sedláček, František | |
| dc.contributor.author | Kroupa, Tomáš | |
| dc.date.accessioned | 2019-03-04T11:50:33Z | |
| dc.date.available | 2019-03-04T11:50:33Z | |
| dc.date.issued | 2018 | |
| dc.description.abstract-translated | The paper deals with the determination of cohesive parameters of adhesive Scotch-Weld DP490 3M. Mode I of cohesive damage were examined. Experimental testing was performed on the test specimens to determine the mechanical properties of the adhesive. The results of the experimental testing were compared with the numerical simulation and analytical solution of the same test. The cohesive parameters of the adhesive were obtained from the numerical simulation. Cohesive parameters of adhesive can be used to design real adhesive bond. | en |
| dc.format | 6 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | KALINA, T., SEDLÁČEK, F., KROUPA, T. Determination of cohesive parameters for mode I of epoxy adhesive. In: Annals of DAAAM and Proceedings of the International DAAAM Symposium. Vídeň, Rakousko: DAAAM International Vienna, 2018. s. 746-751. ISBN 978-3-902734-20-4 , ISSN 1726-9679. | en |
| dc.identifier.doi | 10.2507/29th.daaam.proceedings.108 | |
| dc.identifier.isbn | 978-3-902734-20-4 | |
| dc.identifier.issn | 1726-9679 | |
| dc.identifier.obd | 43924172 | |
| dc.identifier.uri | 2-s2.0-85060112072 | |
| dc.identifier.uri | http://hdl.handle.net/11025/31137 | |
| dc.language.iso | en | en |
| dc.project.ID | LO1502/RoRTI - Rozvoj Regionálního technologického institutu | cs |
| dc.publisher | DAAAM International Vienna | en |
| dc.relation.ispartofseries | Annals of DAAAM and Proceedings of the International DAAAM Symposium | en |
| dc.rights | © DAAAM International Vienna | en |
| dc.rights.access | openAccess | en |
| dc.subject.translated | cohesive parameters | en |
| dc.subject.translated | cohesive damage | en |
| dc.subject.translated | epoxy adhesive | en |
| dc.subject.translated | adhesive bond | en |
| dc.subject.translated | Scotch-Weld DP490 3M, Mode I | en |
| dc.subject.translated | DCB | en |
| dc.title | Determination of cohesive parameters for mode I of epoxy adhesive | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |