Analysis of the Effect of Soldered Surface Roughness on Void Formation Using Computed Tomography

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dc.contributor.authorSteiner, František
dc.contributor.authorHirman, Martin
dc.contributor.authorRous, Pavel
dc.date.accessioned2025-06-20T08:48:22Z
dc.date.available2025-06-20T08:48:22Z
dc.date.issued2023
dc.date.updated2025-06-20T08:48:22Z
dc.description.abstractThis article presents research focused on the reliability of soldered joints. The quality of solder joints is related to the presence of voids in solder joints. Voids affect not only joint strength but also other important joint parameters. The paper presents the results of the Computed Tomography (CT) analysis of solder joints. Samples with different base materials and with different roughness of soldered surfaces were analyzed. The distribution of individual void and the total volume of voids in one joint are the results of the analysis. Histograms of void count and void size are presented too. The article also presents sphericity analysis results where it is possible to see how surface roughness affects the shape and size of the voids.en
dc.format5
dc.identifier.doi10.1109/ISSE57496.2023.10168450
dc.identifier.isbn979-8-3503-3484-5
dc.identifier.obd43939772
dc.identifier.orcidSteiner, František 0000-0002-5702-7015
dc.identifier.orcidHirman, Martin 0000-0002-8481-8971
dc.identifier.orcidRous, Pavel 0000-0002-0158-3602
dc.identifier.urihttp://hdl.handle.net/11025/61194
dc.language.isoen
dc.project.IDSGS-2021-003
dc.project.IDTN02000067/002N
dc.project.IDTN02000067/001N
dc.project.IDTN02000067
dc.publisherIEEE
dc.relation.ispartofseries46th International Spring Seminar on Electronics Technology, ISSE 2023
dc.subjectsolder jointen
dc.subjectvoiden
dc.subjectvoid formationen
dc.subjectsurface roughnessen
dc.subjectlead-free solderen
dc.titleAnalysis of the Effect of Soldered Surface Roughness on Void Formation Using Computed Tomographyen
dc.typeStať ve sborníku (D)
dc.typeSTAŤ VE SBORNÍKU
dc.type.statusPublished Version
local.files.count1*
local.files.size831250*
local.has.filesyes*
local.identifier.eid2-s2.0-85165530348

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