Analysis of the Effect of Soldered Surface Roughness on Void Formation Using Computed Tomography

Abstract

This article presents research focused on the reliability of soldered joints. The quality of solder joints is related to the presence of voids in solder joints. Voids affect not only joint strength but also other important joint parameters. The paper presents the results of the Computed Tomography (CT) analysis of solder joints. Samples with different base materials and with different roughness of soldered surfaces were analyzed. The distribution of individual void and the total volume of voids in one joint are the results of the analysis. Histograms of void count and void size are presented too. The article also presents sphericity analysis results where it is possible to see how surface roughness affects the shape and size of the voids.