Usability Study of Conductive Filament Used for Rapid Prototyping of Interconnect in the Smart Textiles
| dc.contributor.author | Šíma, Karel | |
| dc.contributor.author | Kalaš, David | |
| dc.contributor.author | Soukup, Radek | |
| dc.contributor.author | Řeboun, Jan | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.date.accessioned | 2022-10-17T10:02:23Z | |
| dc.date.available | 2022-10-17T10:02:23Z | |
| dc.date.issued | 2022 | |
| dc.description.abstract | This paper is focused on designing of new rapidprototypingprocess for the creation of interconnections for smart textiles. The best conductive FFF 3dprintingfilament Electrifi was tested. This filament was used for thermal transfer from the printing platform to the textile. The best results were obtained around 30 Ω to 10 cm length interconnection. Interconnection with this value of resistance can be used in light applications such as a heating path in cloths or as a short power delivery path or datapath between components with fme interconnection pads because it is possible to create many highquality motives with the 3D printer in comparison with embroiling machine. | en |
| dc.description.abstract-translated | This paper is focused on designing of new rapidprototypingprocess for the creation of interconnections for smart textiles. The best conductive FFF 3dprintingfilament Electrifi was tested. This filament was used for thermal transfer from the printing platform to the textile. The best results were obtained around 30 Ω to 10 cm length interconnection. Interconnection with this value of resistance can be used in light applications such as a heating path in cloths or as a short power delivery path or datapath between components with fme interconnection pads because it is possible to create many highquality motives with the 3D printer in comparison with embroiling machine. | en |
| dc.format | 5 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | ŠÍMA, K. KALAŠ, D. SOUKUP, R. ŘEBOUN, J. HAMÁČEK, A. Usability Study of Conductive Filament Used for Rapid Prototyping of Interconnect in the Smart Textiles. In 2022 45th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2022. s. 1-5. ISBN: 978-1-66546-589-2 , ISSN: 2161-2536 | cs |
| dc.identifier.document-number | 853642200015 | |
| dc.identifier.doi | 10.1109/ISSE54558.2022.9812767 | |
| dc.identifier.isbn | 978-1-66546-589-2 | |
| dc.identifier.issn | 2161-2536 | |
| dc.identifier.obd | 43936442 | |
| dc.identifier.uri | 2-s2.0-85134234214 | |
| dc.identifier.uri | http://hdl.handle.net/11025/49739 | |
| dc.language.iso | en | en |
| dc.project.ID | SGS-2021-003/Materiály, technologie a diagnostika v elektrotechnice | cs |
| dc.publisher | IEEE | en |
| dc.relation.ispartofseries | 2022 45th International Spring Seminar on Electronics Technology : /proceedings/ | en |
| dc.rights | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. | cs |
| dc.rights | © IEEE | en |
| dc.rights.access | restrictedAccess | en |
| dc.subject.translated | smart textiles | en |
| dc.subject.translated | 3D printing | en |
| dc.subject.translated | interconnection | en |
| dc.subject.translated | conductive filament | en |
| dc.subject.translated | thermal transfer | en |
| dc.title | Usability Study of Conductive Filament Used for Rapid Prototyping of Interconnect in the Smart Textiles | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | ConferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |