Reliability of printed power resistor with thick-film copper terminals

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dc.contributor.authorHlína, Jiří
dc.contributor.authorŘeboun, Jan
dc.contributor.authorJohan, Jan
dc.contributor.authorŠimonovský, Marek
dc.contributor.authorHamáček, Aleš
dc.date.accessioned2019-10-28T11:00:12Z
dc.date.available2019-10-28T11:00:12Z
dc.date.issued2019
dc.description.abstract-translatedThis paper is focused on the thick-film power resistors with copper terminals. These terminals are created by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on an alumina substrate. Thick-film power resistor with copper terminals represents a potential replacement of standard wirewound power resistors and allows the direct integration of resistors on TPC substrates. Printed resistors on TPC substrates can be supplemented with discrete electronic components which creates the possibility to realize really complex power electronic circuits. The direct integration of printed components is not possible in case of using the standard Direct Bonded Copper (DBC) technology. The main benefits of printed resistors based on TPC technology are their low thickness and good thermal conductivity. The low thickness of resistors is important for miniaturization of final electronic devices. The resistor main electrical parameters as the temperature coefficient of resistance, temperature coefficient and nominal resistance value after dry heat aging and after thermal cycling, insulation resistance, dielectric strength etc., are described in this paper.en
dc.format8 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationHLÍNA, J., ŘEBOUN, J., JOHAN, J., ŠIMONOVSKÝ, M., HAMÁČEK, A. Reliability of printed power resistor with thick-film copper terminals. Microelectronic Engineering, 2019, roč. 216, č. August 2019, s. 1-8. ISSN 0167-9317.en
dc.identifier.document-number487764900020
dc.identifier.doi10.1016/j.mee.2019.111095
dc.identifier.issn0167-9317
dc.identifier.obd43926540
dc.identifier.uri2-s2.0-85069660775
dc.identifier.urihttp://hdl.handle.net/11025/35697
dc.language.isoenen
dc.project.IDEF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligencecs
dc.publisherElsevieren
dc.relation.ispartofseriesMicroelectronic Engineeringen
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© Elsevieren
dc.rights.accessrestrictedAccessen
dc.subject.translatedthick printed copperen
dc.subject.translatedthick-film resistoren
dc.subject.translatedresistor reliabilityen
dc.subject.translatedpower resistoren
dc.titleReliability of printed power resistor with thick-film copper terminalsen
dc.typečlánekcs
dc.typearticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

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