Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications
Date issued
2021
Authors
Journal Title
Journal ISSN
Volume Title
Publisher
MDPI
Abstract
Description
Subject(s)
Citation
HLÍNA, J. ŘEBOUN, J. HAMÁČEK, A. Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications. Materials, 2021, roč. 14, č. 22, s. 1-7. ISSN: 1996-1944