Dielectric, structural and mechanical properties of thermally aged biaxially oriented polymeric substrates for flexible electronics

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hornak_1-s2.0-S0141391022000921-main.pdf (2.83 MB)

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2022

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Elsevier

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HORNAK, J. KADLEC, P. KOPŘIVA, J. POLANSKÝ, R. Dielectric, structural and mechanical properties of thermally aged biaxially oriented polymeric substrates for flexible electronics. POLYMER DEGRADATION AND STABILITY, 2022, roč. 199, č. May 2022, s. 1-10. ISSN: 0141-3910

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https://doi.org/2-s2.0-85127113721
 http://hdl.handle.net/11025/47717
 https://doi.org/10.1016/j.polymdegradstab.2022.109906

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