Properties of thick printed copper films on aluminum nitride substrates
| dc.contributor.author | Hlína, Jiří | |
| dc.contributor.author | Řeboun, Jan | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.date.accessioned | 2022-10-17T10:02:21Z | |
| dc.date.available | 2022-10-17T10:02:21Z | |
| dc.date.issued | 2021 | |
| dc.description.abstract | This paper is focused on the properties of Thi ck Printed Copper (TPC) films printed on aluminum nitride (AlN) substrates. TPC technology is based on thick film technology and it is predominantly intended for power substrate manufacturing. TPC films can be also printed on ceramic substrates with high thermal conductivity such as AlN and this combination enables the realization of high power substrates. The electrical and mechanical parameters and structure of TPC films on AlN substrates are described in this paper. | en |
| dc.description.abstract-translated | This paper is focused on the properties of Thi ck Printed Copper (TPC) films printed on aluminum nitride (AlN) substrates. TPC technology is based on thick film technology and it is predominantly intended for power substrate manufacturing. TPC films can be also printed on ceramic substrates with high thermal conductivity such as AlN and this combination enables the realization of high power substrates. The electrical and mechanical parameters and structure of TPC films on AlN substrates are described in this paper. | en |
| dc.format | 5 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | HLÍNA, J. ŘEBOUN, J. HAMÁČEK, A. Properties of thick printed copper films on aluminum nitride substrates. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7 | cs |
| dc.identifier.document-number | 853459100037 | |
| dc.identifier.doi | 10.1109/ISSE51996.2021.9467591 | |
| dc.identifier.isbn | 978-1-66541-477-7 | |
| dc.identifier.obd | 43933004 | |
| dc.identifier.uri | 2-s2.0-85113985913 | |
| dc.identifier.uri | http://hdl.handle.net/11025/49723 | |
| dc.language.iso | en | en |
| dc.project.ID | EF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligence | cs |
| dc.project.ID | FW01010067/Pokročilé keramické materiály a technologie pro výkonovou elektroniku POKER | cs |
| dc.project.ID | SGS-2021-003/Materiály, technologie a diagnostika v elektrotechnice | cs |
| dc.publisher | IEEE | en |
| dc.relation.ispartofseries | 2021 44th International Spring Seminar on Electronics Technology : /proceedings/ | en |
| dc.rights | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. | cs |
| dc.rights | © IEEE | en |
| dc.rights.access | restrictedAccess | en |
| dc.subject.translated | thick film | en |
| dc.subject.translated | aluminum nitride | en |
| dc.subject.translated | TPC | en |
| dc.subject.translated | power electronics | en |
| dc.title | Properties of thick printed copper films on aluminum nitride substrates | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | ConferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
Files
Original bundle
1 - 1 out of 1 results
No Thumbnail Available
- Name:
- Hlina_09467591.pdf
- Size:
- 4.12 MB
- Format:
- Adobe Portable Document Format