Testing of electromigration resistance of copper and silver thick films

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dc.contributor.authorHlína, Jiří
dc.contributor.authorŘeboun, Jan
dc.contributor.authorŠimonovský, Marek
dc.contributor.authorHamáček, Aleš
dc.date.accessioned2025-06-20T08:49:36Z
dc.date.available2025-06-20T08:49:36Z
dc.date.issued2023
dc.date.updated2025-06-20T08:49:36Z
dc.description.abstractThis paper is focused on the electromigration resistance of copper and silver thick films. Electromigration was tested by water drop test. Four common conductive thick film pastes were used for testing – silver paste with low platinum content, and two silver pastes with different content of palladium and copper paste. Electromigration was tested under voltage of 6 and 12 V and time to shortcut was measured. Results of testing including the comparison of electromigration resistance depending on thick film paste type and different electrode spacing are described in this paper.en
dc.format5
dc.identifier.doi10.23919/EMPC55870.2023.10418299
dc.identifier.isbn978-0-9568086-9-1
dc.identifier.obd43941521
dc.identifier.orcidHlína, Jiří 0000-0002-0900-7300
dc.identifier.orcidŘeboun, Jan 0000-0002-8680-2199
dc.identifier.orcidHamáček, Aleš 0000-0003-1563-5888
dc.identifier.urihttp://hdl.handle.net/11025/61311
dc.language.isoen
dc.project.IDSGS-2021-003
dc.project.IDFW01010067
dc.publisherIEEE
dc.relation.ispartofseries24th European Microelectronics and Packaging Conference & Exhibition, EMPC 2023
dc.subjectelectromigrationen
dc.subjectcopperen
dc.subjectsilveren
dc.subjectthick filmen
dc.subjectwater drop testen
dc.titleTesting of electromigration resistance of copper and silver thick filmsen
dc.typeStať ve sborníku (D)
dc.typeSTAŤ VE SBORNÍKU
dc.type.statusPublished Version
local.files.count1*
local.files.size2061011*
local.has.filesyes*
local.identifier.eid2-s2.0-85186140368

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