Testing of electromigration resistance of copper and silver thick films

Abstract

This paper is focused on the electromigration resistance of copper and silver thick films. Electromigration was tested by water drop test. Four common conductive thick film pastes were used for testing – silver paste with low platinum content, and two silver pastes with different content of palladium and copper paste. Electromigration was tested under voltage of 6 and 12 V and time to shortcut was measured. Results of testing including the comparison of electromigration resistance depending on thick film paste type and different electrode spacing are described in this paper.