Bend testing of SMD chip resistors glued on flexible substrates
Date issued
2019
Journal Title
Journal ISSN
Volume Title
Publisher
IEEE
Abstract
Description
Subject(s)
Citation
HIRMAN, M., NEUHÖFER, T., STEINER, F. Bend testing of SMD chip resistors glued on flexible substrates. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-6. ISBN 978-1-7281-1874-1 , ISSN 2161-2528.