Improvement of thick printed copper substrates solderability by formic acid
| dc.contributor.author | Michal, D. | |
| dc.contributor.author | Hirman, M. | |
| dc.contributor.author | Řeboun, J. | |
| dc.contributor.editor | Pihera, Josef | |
| dc.contributor.editor | Steiner, František | |
| dc.date.accessioned | 2020-02-25T09:29:24Z | |
| dc.date.available | 2020-02-25T09:29:24Z | |
| dc.date.issued | 2019 | |
| dc.description.abstract-translated | This paper deals with solderability of thick printed copper substrates using formic acid vapours in combination with vacuum soldering technology. The topic of low void, preferably void free joints in the field of electronics is important, because of rising demand in high-power applications. Void presence can cause many negative effects such as localized overheating or mechanical stress vulnerability which can result into cracks and splits. If the joints are partially or fully destroyed, the product is non-functional and can lead to its total destruction. This condition can result even in life threatening situation. | en |
| dc.format | 3 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | Electroscope. 2019, č. 2. | cs |
| dc.identifier.issn | 1802-4564 | |
| dc.identifier.uri | http://hdl.handle.net/11025/36525 | |
| dc.language.iso | en | en |
| dc.publisher | Západočeská univerzita v Plzni, Fakulta elektrotechnická | cs |
| dc.rights | Copyright © 2019 Electroscope. All Rights Reserved. | en |
| dc.rights.access | openAccess | en |
| dc.subject | pájitelnost | cs |
| dc.subject | užití par kyseliny mravenčí | cs |
| dc.subject | technologie vakuového pájení | cs |
| dc.subject | keramických substrátech s měděným motivem | cs |
| dc.subject | keramické substráty s měděným motivem | cs |
| dc.subject.translated | solderability | en |
| dc.subject.translated | using formic acid vapours | en |
| dc.subject.translated | vacuum soldering technology | en |
| dc.subject.translated | thick printed copper substrates | en |
| dc.title | Improvement of thick printed copper substrates solderability by formic acid | en |
| dc.type | článek | cs |
| dc.type | article | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
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