FFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymers

Date issued

2021

Authors

Journal Title

Journal ISSN

Volume Title

Publisher

MDPI

Abstract

Description

Subject(s)

Citation

KALAŠ, D. ŠÍMA, K. KADLEC, P. POLANSKÝ, R. SOUKUP, R. ŘEBOUN, J. HAMÁČEK, A. FFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymers. Polymers, 2021, roč. 13, č. 21, s. 1-16. ISSN: 2073-4360

Item identifier

https://doi.org/2-s2.0-85118479478
 https://doi.org/htthp://hdl.handle.net/11025/46669
 https://doi.org/10.3390/polym13213702

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OBD
 Conference papers (RICE)
 Articles (KET)