Modeling of the heat transfer in the switchboard cabinet

dc.contributor.author	Kohout, Jan
dc.contributor.author	Šroubová, Lenka
dc.date.accessioned	2021-11-12T13:42:59Z
dc.date.available	2021-11-12T13:42:59Z
dc.date.issued	2021
dc.description.abstract-translated	This paper deals with the modeling of a heat transfer in the switchboard cabinet by using the COMSOL Multiphysics software. The heat transfer field distribution can be seen from a typical example and discussion of its results. Furthermore, the results of simulations and performed measurements are compared for the selected cooling variant.	en
dc.format	2 s.	cs
dc.format.mimetype	application/pdf
dc.identifier.citation	Proceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 125-126.	en
dc.identifier.isbn	978-80-261-0930-3
dc.identifier.uri	http://hdl.handle.net/11025/45821
dc.language.iso	en	en
dc.publisher	Faculty of Electrical Engineering, University of West Bohemia	en
dc.rights	© IEEE	en
dc.rights.access	openAccess	en
dc.subject	rozvaděčová skříň	cs
dc.subject	přenos tepla	cs
dc.subject	simulace	cs
dc.subject.translated	switchboard cabinet	en
dc.subject.translated	heat transfer	en
dc.subject.translated	simulation	en
dc.title	Modeling of the heat transfer in the switchboard cabinet	en
dc.type	konferenční příspěvek	cs
dc.type	conferenceObject	en
dc.type.status	Peer-reviewed	en
dc.type.version	publishedVersion	en

Files

Showing 1 - 2 out of 2 results

Showing 1 - 1 out of 1 results