Advanced application capabilities of thick printed copper technology
| dc.contributor.author | Hlína, Jiří | |
| dc.contributor.author | Řeboun, Jan | |
| dc.contributor.author | Johan, Jan | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.date.accessioned | 2020-03-30T10:00:23Z | |
| dc.date.available | 2020-03-30T10:00:23Z | |
| dc.date.issued | 2019 | |
| dc.description.abstract | This paper is focused on the advanced capabilities of Thick Printed Copper (TPC) technology used for power electronic substrate manufacturing. TPC technology is based on screen printing of special copper pastes on ceramic substrates and its firing in a nitrogen atmosphere. This technology can be used as an alternative solution to conventional metallization techniques such as DBC or AMB and enables wide-range interconnection capabilities which cannot be realized with these conventional techniques. TPC interconnection capabilities include multilayer structures, copper plated vias and integrated passive components. Parameters and reliability of above-mentioned TPC structures after accelerated aging and thermal shock cycling are described in this paper. | en |
| dc.format | 5 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | HLÍNA, J., ŘEBOUN, J., JOHAN, J., HAMÁČEK, A. Advanced application capabilities of thick printed copper technology. In: Proceedings of the 22nd Microelectronics and Packaging Conference (EMPC 2019). Piscataway: IEEE, 2019. s. 1-5. ISBN 978-0-9568086-6-0. | en |
| dc.identifier.doi | 10.23919/EMPC44848.2019.8951789 | |
| dc.identifier.isbn | 978-0-9568086-6-0 | |
| dc.identifier.obd | 43926854 | |
| dc.identifier.uri | 2-s2.0-85078827997 | |
| dc.identifier.uri | http://hdl.handle.net/11025/36780 | |
| dc.language.iso | en | en |
| dc.project.ID | EF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligence | cs |
| dc.project.ID | LO1607/RICE-NETESIS - nové technologie a koncepce pro inteligentní průmyslové systémy (NETESIS) | cs |
| dc.publisher | IEEE | en |
| dc.relation.ispartofseries | Proceedings of the 22nd Microelectronics and Packaging Conference (EMPC 2019) | en |
| dc.rights | Plný text není přístupný. | cs |
| dc.rights | © IEEE | en |
| dc.rights.access | closedAccess | en |
| dc.subject.translated | thick printed copper | en |
| dc.subject.translated | TPC | en |
| dc.subject.translated | power electronic substrates | en |
| dc.subject.translated | alumina | en |
| dc.subject.translated | multilayer structures | en |
| dc.title | Advanced application capabilities of thick printed copper technology | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |