Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs
Date issued
2019
Authors
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Publisher
Západočeská univerzita v Plzni
Abstract
Description
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Citation
HIRMAN, M., STEINER, F. Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs. Electroscope, 2019, roč. 2019, č. 2, s. 1-6. ISSN 1802-4564.