Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles

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dc.contributor.authorHirman, Martin
dc.contributor.authorHamerník, Karel
dc.contributor.authorKalaš, David
dc.contributor.authorNavrátil, Jiří
dc.contributor.authorMoravcová, Daniela
dc.contributor.authorSteiner, František
dc.date.accessioned2023-01-16T11:00:17Z
dc.date.available2023-01-16T11:00:17Z
dc.date.issued2022
dc.description.abstract-translatedThis article addresses the real-life functional research of electrically conductive joints of SMD components onto the electrically conductive textile stretchable ribbons. The four different connection techniques were used in the research: soldering, electrically conductive adhesive bonding, thermocompression, and non-conductive adhesive bonding. The 20 weeks of testing, including periodical weight training and washing, were realized. It can be concluded that soldering and both adhesive bonding technique are usable. The results showed that the electrical resistance of soldered samples was stable for the whole testing time and can be recommended. The results also showed that the electrical resistance of both adhesive bonded samples was growing at the first few testing cycles and stabilized for the rest many weeks of testing. It follows that also these adhesive bonding techniques can be recommended for some applications where the higher (but stable) joints resistance is acceptable.en
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationHIRMAN, M. HAMERNÍK, K. KALAŠ, D. NAVRÁTIL, J. MORAVCOVÁ, D. STEINER, F. Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles. In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedings. Piscataway: IEEE, 2022. s. 223-227. ISBN: 978-1-66548-947-8cs
dc.identifier.doi10.1109/ESTC55720.2022.9939515
dc.identifier.isbn978-1-66548-947-8
dc.identifier.obd43937056
dc.identifier.uri2-s2.0-85143149276
dc.identifier.urihttp://hdl.handle.net/11025/50936
dc.language.isoenen
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
dc.publisherIEEEen
dc.relation.ispartofseries2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedingsen
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.rights.accessrestrictedAccessen
dc.subject.translatedsolderingen
dc.subject.translatedelectrically conductive adhesive bonding (ECA)en
dc.subject.translatednon-conductive adhesive bonding (NCA)en
dc.subject.translatedthermocompressionen
dc.subject.translatedelectrically conductive textile stretchable ribbonsen
dc.subject.translatedfunctional testsen
dc.subject.translatedsports jersey e-textileen
dc.titleReal-Life Functional Tests of Conductive Joints of SMD Components on E-Textilesen
dc.typekonferenční příspěvekcs
dc.typeConferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionacceptedVersionen

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