Study of co-fired multilayer structures based on Thick Printed Copper technology
| dc.contributor.author | Hlína, Jiří | |
| dc.contributor.author | Řeboun, Jan | |
| dc.contributor.author | Heřmanský, Vojtěch | |
| dc.contributor.author | Šimonovský, Marek | |
| dc.contributor.author | Johan, Jan | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.date.accessioned | 2019-02-11T11:00:16Z | |
| dc.date.available | 2019-02-11T11:00:16Z | |
| dc.date.issued | 2019 | |
| dc.description.abstract-translated | This paper is focused on the study of co-fired multilayer structures realized by Thick Printed Copper (TPC) technology. TPC technology is used for the manufacturing of substrates for power applications and it enables simple manufacturing of multilayer structures. These structures usually consist of two copper films separated by a dielectric film which are commonly fired individually. Co-firing of these films can reduce production costs and time. It does not deteriorate electrical parameters. The influence of co-firing of different film combinations on the inner structure, electrical and mechanical parameters and also the changes of these parameters after aging and thermal cycling are described in this paper. | en |
| dc.format | 4 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | HLÍNA, J., ŘEBOUN, J., HEŘMANSKÝ, V., ŠIMONOVSKÝ, M., JOHAN, J., HAMÁČEK, A. Study of co-fired multilayer structures based on Thick Printed Copper technology. Materials Letters, 2019, roč. 238, č. 1 March, s. 313-316. ISSN 0167-577X. | en |
| dc.identifier.document-number | 455472800079 | |
| dc.identifier.doi | 10.1016/j.matlet.2018.12.040 | |
| dc.identifier.issn | 0167-577X | |
| dc.identifier.obd | 43924407 | |
| dc.identifier.uri | 2-s2.0-85058782319 | |
| dc.identifier.uri | http://hdl.handle.net/11025/30931 | |
| dc.language.iso | en | en |
| dc.project.ID | FV20140/Pokročilý materiálový systém pro výrobu chytré výkonové elektroniky ADMAT | cs |
| dc.project.ID | LO1607/RICE-NETESIS - nové technologie a koncepce pro inteligentní průmyslové systémy (NETESIS) | cs |
| dc.publisher | Elsevier | en |
| dc.rights | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. | cs |
| dc.rights | © Elsevier | en |
| dc.rights.access | restrictedAccess | en |
| dc.subject.translated | ceramics | en |
| dc.subject.translated | deposition | en |
| dc.subject.translated | electrical properties | en |
| dc.subject.translated | thick films | en |
| dc.subject.translated | dielectrics | en |
| dc.subject.translated | multilayer structures | en |
| dc.title | Study of co-fired multilayer structures based on Thick Printed Copper technology | en |
| dc.type | článek | cs |
| dc.type | article | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |