Relationship of soldering profile, voids, formation and strength of soldered joints
Date issued
2019
Journal Title
Journal ISSN
Volume Title
Publisher
IEEE
Abstract
Description
Subject(s)
Citation
STEINER, F., WIRTH, V., HIRMAN, M. Relationship of soldering profile, voids, formation and strength of soldered joints. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-6. ISBN 978-1-7281-1874-1 , ISSN 2161-2528.