Relationship of soldering profile, voids, formation and strength of soldered joints

Date issued

2019

Journal Title

Journal ISSN

Volume Title

Publisher

IEEE

Abstract

Description

Subject(s)

Citation

STEINER, F., WIRTH, V., HIRMAN, M. Relationship of soldering profile, voids, formation and strength of soldered joints. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-6. ISBN 978-1-7281-1874-1 , ISSN 2161-2528.
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