Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate
Date issued
2019
Journal Title
Journal ISSN
Volume Title
Publisher
Springer
Abstract
Description
Subject(s)
Citation
HIRMAN, M., NAVRÁTIL, J., STEINER, F., DŽUGAN, T., HAMÁČEK, A. Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate. Journal of Materials Science: Materials in Electronics, 2019, roč. 30, č. 15, s. 14214-14223. ISSN 0957-4522.