Behaviour of printed resistors compatible with thick film copper technology
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2022
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IEEE
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HLÍNA, J. ŘEBOUN, J. HAMÁČEK, A. Behaviour of printed resistors compatible with thick film copper technology. In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedings. Piscataway: IEEE, 2022. s. 228-232. ISBN: 978-1-66548-947-8