Behaviour of printed resistors compatible with thick film copper technology

Date issued

2022

Journal Title

Journal ISSN

Volume Title

Publisher

IEEE

Abstract

Description

Subject(s)

Citation

HLÍNA, J. ŘEBOUN, J. HAMÁČEK, A. Behaviour of printed resistors compatible with thick film copper technology. In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedings. Piscataway: IEEE, 2022. s. 228-232. ISBN: 978-1-66548-947-8
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