Examination of Wet Assembling Methods in Printed Flexible Electronics

Abstract

This paper examines two methods of assembling electronics SMD components on flexible substrates with low-temperature resistance. As a contact medium for interconnection between component and conductive pattern, conductive adhesive MG Chemicals 8331S-15G or conductive Ag printing paste DuPont PE 874 was used. The contact resistance of samples was measured after the assembling process and then mechanical tests were performed. Samples were subjected to a bend test and a rapid change of temperature in the shock chamber. Tests have shown that Ag paste can withstand high mechanical and temperature stress due to its stretchability and can partly return to its previous state after mechanical stress is released. On the other hand, conductive adhesive, which is rigid, tends to fail under high mechanical and temperature stress. Ag paste shows great assumptions to be used in the field of flexible or even stretchable electronics as a contact medium.