Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly
Date issued
2019
Journal Title
Journal ISSN
Volume Title
Publisher
Springer
Abstract
Description
Subject(s)
Citation
MACH, P., GECZY, A., POLANSKÝ, R., BUŠEK, D. Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly. Journal of Materials Science: Materials in Electronics, 2019, roč. 30, č. 5, s. 4895-4907. ISSN 0957-4522.