Analysis and Sintering Optimization of Nanoparticle Paste with High Silver Content

dc.contributor.authorMichal, David
dc.contributor.authorJanda, Martin
dc.contributor.authorŘeboun, Jan
dc.date.accessioned2022-10-24T10:00:10Z
dc.date.available2022-10-24T10:00:10Z
dc.date.issued2022
dc.description.abstractThis paper deals with analysis, testing, and process optimization of new nanoparticle silvering paste with high silver content. Specifically, on ceramic substrates with printed conductive patterns created by thick film technology. Sintering is currently one of the most anticipated ways of connecting dies on substrates in power electronics field. Using ceramic substrates in combination with printed patterns brings out new challenges because of porous structure and ceramic specific attributes, especially when using presureless sintering as in this case. Presented paper is focused on analysis and comparison of structure and behaviour of the new nanoparticle paste with commercially available silver sintering pastes. Following step was initial testing with different deposition techniques and development of optimal sintering profile. After sintering examinations were also carried out. Shear test showing mechanical resilience, x-ray scanning for analysis of internal structure and stereoscopic analysis of sintered paste. Prolonging the temperature peak from 45 to 60 minutes and rising its temperature to 280°C shows better results in created joint. Higher shear strength was achieved together with more homogenous sintered structure. Lower porosity and presence of nanoparticles shows great potential for more homogenous, stable, and more resistive connection to mechanical separation.en
dc.description.abstract-translatedThis paper deals with analysis, testing, and process optimization of new nanoparticle silvering paste with high silver content. Specifically, on ceramic substrates with printed conductive patterns created by thick film technology. Sintering is currently one of the most anticipated ways of connecting dies on substrates in power electronics field. Using ceramic substrates in combination with printed patterns brings out new challenges because of porous structure and ceramic specific attributes, especially when using presureless sintering as in this case. Presented paper is focused on analysis and comparison of structure and behaviour of the new nanoparticle paste with commercially available silver sintering pastes. Following step was initial testing with different deposition techniques and development of optimal sintering profile. After sintering examinations were also carried out. Shear test showing mechanical resilience, x-ray scanning for analysis of internal structure and stereoscopic analysis of sintered paste. Prolonging the temperature peak from 45 to 60 minutes and rising its temperature to 280°C shows better results in created joint. Higher shear strength was achieved together with more homogenous sintered structure. Lower porosity and presence of nanoparticles shows great potential for more homogenous, stable, and more resistive connection to mechanical separation.en
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationMICHAL, D. JANDA, M. ŘEBOUN, J. Analysis and Sintering Optimization of Nanoparticle Paste with High Silver Content. In 2022 45th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2022. s. 1-5. ISBN: 978-1-66546-589-2 , ISSN: 2161-2536cs
dc.identifier.document-number853642200055
dc.identifier.doi10.1109/ISSE54558.2022.9812812
dc.identifier.isbn978-1-66546-589-2
dc.identifier.issn2161-2536
dc.identifier.obd43936448
dc.identifier.uri2-s2.0-85134232010
dc.identifier.urihttp://hdl.handle.net/11025/49767
dc.language.isoenen
dc.project.IDEF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligencecs
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
dc.publisherIEEEen
dc.relation.ispartofseries2022 45th International Spring Seminar on Electronics Technology : /proceedings/en
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.rights.accessrestrictedAccessen
dc.subject.translatedpressureless sinteringen
dc.subject.translatednanoparticleen
dc.subject.translatedsilver-based pasteen
dc.subject.translatedceramic substrateen
dc.titleAnalysis and Sintering Optimization of Nanoparticle Paste with High Silver Contenten
dc.typekonferenční příspěvekcs
dc.typeConferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

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