Stretchability of Printed Conductive Structures for Thermoformable Structural Electronics

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dc.contributor.authorUrban, Adam
dc.contributor.authorPretl, Silvan
dc.contributor.authorJanda, Martin
dc.date.accessioned2025-06-20T08:46:14Z
dc.date.available2025-06-20T08:46:14Z
dc.date.issued2024
dc.date.updated2025-06-20T08:46:14Z
dc.description.abstractIn this paper, the methodology for stretchability and thermoformability of printable conductive materials is developed. Thermoforming is the process of heating materials to their softening temperatures, followed by shaping over a mold. To examine and understand the stretching of foil during the thermoforming process, variable geometry of mold is proposed. The graphical grid is applied on a polycarbonate foil, and its deformation is evaluated. Based on these results, deformation of foil can be observed. After that, using the same method, the stretchability of various conductive printed electronics materials is observed its usability is evaluated.en
dc.format6
dc.identifier.document-number001283808200048
dc.identifier.doi10.1109/ISSE61612.2024.10603907
dc.identifier.isbn979-8-3503-8547-2
dc.identifier.issn2161-2528
dc.identifier.obd43943537
dc.identifier.orcidUrban, Adam 0009-0009-1883-1156
dc.identifier.orcidPretl, Silvan 0000-0002-0756-9457
dc.identifier.orcidJanda, Martin 0000-0003-4079-0556
dc.identifier.urihttp://hdl.handle.net/11025/60982
dc.language.isoen
dc.project.IDSGS-2024-008
dc.project.IDTN02000067
dc.publisherIEEE
dc.relation.ispartofseries47th International Spring Seminar on Electronics Technology, ISSE 2024
dc.subjectin-mold technologyen
dc.subjectthermoformingen
dc.subject3D printingen
dc.subjectprinted electronicsen
dc.titleStretchability of Printed Conductive Structures for Thermoformable Structural Electronicsen
dc.typeStať ve sborníku (D)
dc.typeSTAŤ VE SBORNÍKU
dc.type.statusPublished Version
local.files.count1*
local.files.size4273849*
local.has.filesyes*
local.identifier.eid2-s2.0-85200514781

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