Stretchability of Printed Conductive Structures for Thermoformable Structural Electronics

Abstract

In this paper, the methodology for stretchability and thermoformability of printable conductive materials is developed. Thermoforming is the process of heating materials to their softening temperatures, followed by shaping over a mold. To examine and understand the stretching of foil during the thermoforming process, variable geometry of mold is proposed. The graphical grid is applied on a polycarbonate foil, and its deformation is evaluated. Based on these results, deformation of foil can be observed. After that, using the same method, the stretchability of various conductive printed electronics materials is observed its usability is evaluated.