Aerosol Jet® bondování SMD součástek
| dc.contributor.author | Navrátil, Jiří | |
| dc.contributor.editor | Fiřt, Jaroslav | |
| dc.date.accessioned | 2017-11-13T12:32:09Z | |
| dc.date.available | 2017-11-13T12:32:09Z | |
| dc.date.issued | 2016 | |
| dc.description.abstract-translated | This paper presents a research focused on Aerosol Jet® bonding of SMD components to flexible substrates. Flexible printed electronics is becoming important fast growing market segment. Contacting technologies of the electronic components are well known for traditional electronics such as soldering, welding, conductive adhesive bonding, however in the expansion of direct printing technologies the new possibilities have raised. Except for using conductive adhesives the Aerosol Jet® technology can be used for contacting. | en |
| dc.format | 4 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | FIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 3.-4. listopadu 2016. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2016, s. [110-114]. | cs |
| dc.identifier.isbn | 978–80–261–0516–9 | |
| dc.identifier.uri | http://hdl.handle.net/11025/26515 | |
| dc.language.iso | cs | cs |
| dc.publisher | Západočeská univerzita v Plzni | cs |
| dc.rights | © Západočeská univerzita v Plzni | cs |
| dc.rights.access | openAccess | en |
| dc.subject | Aerosol Jet | cs |
| dc.subject | bondování | cs |
| dc.subject | tištěná elektronika | cs |
| dc.subject | SMD | cs |
| dc.subject.translated | Aerosol Jet | en |
| dc.subject.translated | bonding | en |
| dc.subject.translated | printed electronics | en |
| dc.subject.translated | SMD | en |
| dc.title | Aerosol Jet® bondování SMD součástek | cs |
| dc.title.alternative | Aerosol Jet® SMD components bonding | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
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