SMD Components Recycling Procedure for Reuse in E-Textiles with Risk Analysis

Abstract

This paper deals remanufacturing method for the reuse of adhesive bonded SMD components on stretchable textile ribbons for integration in e-textiles and its risk analysis. Nowadays, e-waste is an increasing problem in the world, and reducing this problem by using circular economy principles and reusing components is beneficial. In our research, the samples were submitted for accelerated ageing by dry heat and their quality was evaluated by the electrical resistance measurement. The recycling procedure was realized four times, and the mentioned risk analysis was realized before and after the experiment. The two main goals of our research were determined. The first goal was to demonstrate the applicability of our recycling procedure and the quality of samples with reused components after accelerated climatic ageing by dry heat. The second goal was to create and verify the risk analysis of our method and identify actions to mitigate the high and very high risks. The experiment showed that our recycling method is applicable several times without decreasing product quality. The results also present that reused samples are functional like new even after samples dry heat ageing. The risk analysis after the experiment showed seven high risks, which is necessary to solve primarily. These risk factors and actions to mitigate them are described in the paper.