Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution

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dc.contributor.authorSorokina, Kristina
dc.contributor.authorBušek, David
dc.contributor.authorDušek, Karel
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2020-02-25T07:27:18Z
dc.date.available2020-02-25T07:27:18Z
dc.date.issued2019
dc.description.abstract-translatedIn this article, the electrochemical migration of lead-free solders and electrically conductive adhesives with an Ag content of more than 70% was studied by using a water drop test in NaCl solution. The results of solder pastes were compared with the results of electrically conductive adhesives. It was found that some solder pastes with a low Ag content have a lower susceptibility to electrochemical migration than, for example, solder paste Sn42Bi58. The highest resistance to corrosion has a conductive adhesive CRM-1033B with an Ag content of 75%. Resistance and voltage during the water drop test. From the measured values, it was determined that the values of resistance and voltage decrease with dendrite growing. X-ray spectroscopy was also performed to determine the chemical elemental composition of dendrites. It was found that the dominant element of the dendrite of solder pastes was Sn. In the case of electrically conductive adhesives, Ag was the main element of the dendrite.en
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationElectroscope. 2019, č. 2.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://hdl.handle.net/11025/36515
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.rightsCopyright © 2019 Electroscope. All Rights Reserved.en
dc.rights.accessopenAccessen
dc.subjectroztok NaClcs
dc.subjectkapka vodycs
dc.subjectelektrochemická migracecs
dc.subjectbezolovnaté pájkycs
dc.subject.translatedNaCl solutionen
dc.subject.translatedwater dropen
dc.subject.translatedelectrochemical migrationen
dc.subject.translatedlead-free soldersen
dc.titleElectrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solutionen
dc.typečlánekcs
dc.typearticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

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Číslo 2 (2019)
Číslo 2 (2019)