Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study

Abstract

In an era where electronic waste is a growing concern, this paper introduces a groundbreaking recycling and reuse methodology for SMD chip components in e-textiles, promising a sustainable future for the electronics industry. Our innovative technique harnesses a UV-curable acrylic adhesive to conductively affix SMD components onto the electrically conductive paths in the textile stretchable ribbons. In the method, the SMD component is pressed onto the conductive paths and fixed in the direct intimate contact with the mentioned adhesive. These joints can be easily detached at the end of their lifecycle. This process not only conserves raw materials and minimizes waste but also significantly cuts production costs. Through realized experimentation, we demonstrate that the electrical resistance of reused joints remains stable, showing no substantial degradation when compared to new joints, even after salt spray ageing. This finding confirms that the performance of reused components is on par with new ones (at least when used twice), thus ensuring reliability in practical applications. While the method's applicability varies across different component types, it is advantageous, particularly for high-value parts or those in short supply. Engage with our full article to explore how this technique can improve component lifecycle management and pave the way for a more sustainable electronics landscape.