Optimization of Printed Circuit board design assembly based on DPMO metrics

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dc.contributor.authorSoukup, Radek
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2012-11-01T11:18:53Z
dc.date.available2012-11-01T11:18:53Z
dc.date.issued2011
dc.description.abstract-translatedThe paper deals with optimization of printed circuit board assembly (PCBA) design based on defects per million opportunities (DPMO) metric. Due to DPMO data predictions for a given new PCBA design is possible to optimize its layout in terms of yield and quality even before the PCBA pilot production. The DPMO data are obtained from the below presented yield-DPMO model. The model is based on a combination of elements from DPMO calculation according to the IPC 7912 standard and two most used yield prediction methodologies, namely: process yield and board design yield. The model provides not only DPMO data, but also assembly process yield prediction that can assist the manufacturers in determining reliable estimates of production capabilities.en
dc.format4 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationElectroscope. 2010, č. 4.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://hdl.handle.net/11025/589
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rightsCopyright © 2007-2010 Electroscope. All Rights Reserved.en
dc.rights.accessopenAccessen
dc.subjectprocesní metrikycs
dc.subjectDPMOcs
dc.subjectoptimalizace procesůcs
dc.subjectmontážcs
dc.subjectdesky plošných spojůcs
dc.subject.translatedprocess metricsen
dc.subject.translatedprocess optimizationen
dc.subject.translatedassemblyen
dc.subject.translatedprinted circuit boarden
dc.subject.translatedDPMOen
dc.titleOptimization of Printed Circuit board design assembly based on DPMO metricsen
dc.typečlánekcs
dc.typearticleen
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

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