SIMCENTER, engineering complex products from Siemens PLM Software for electronic cooling
| dc.contributor.author | Trubelová, Šárka | |
| dc.contributor.editor | Pihera, Josef | |
| dc.contributor.editor | Steiner, František | |
| dc.date.accessioned | 2019-02-21T10:31:08Z | |
| dc.date.available | 2019-02-21T10:31:08Z | |
| dc.date.issued | 2018 | |
| dc.description.abstract-translated | For electronic devices, temperature is a limiting factor. Packing technology, driven by constant consumer demand and competitive pressure, allows higher power density than current cooling technology can handle. Sustained elevated temperatures act to not only reduce component efficiency, but also to reduce product life. We present a unique platform SimcenterTM that enables predictive engineering analytics by bringing a strong alignment between 1D simulation and 3D computer-aided engineering (CAE). | en |
| dc.format | 3 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | Electroscope. 2018, č. 1. | cs |
| dc.identifier.issn | 1802-4564 | |
| dc.identifier.uri | http://hdl.handle.net/11025/31003 | |
| dc.language.iso | en | en |
| dc.publisher | Západočeská univerzita v Plzni, Fakulta elektrotechnická | cs |
| dc.relation.ispartofseries | Electroscope | cs |
| dc.rights | Copyright © 2018 Electroscope. All Rights Reserved. | en |
| dc.rights.access | openAccess | en |
| dc.subject | elektronická zařízení | cs |
| dc.subject | elektronické chlazení | cs |
| dc.subject | chytrá technologie | cs |
| dc.subject | SimcenterTM | cs |
| dc.subject.translated | electronic devices | en |
| dc.subject.translated | electronic cooling | en |
| dc.subject.translated | smart technology | en |
| dc.subject.translated | SimcenterTM | en |
| dc.title | SIMCENTER, engineering complex products from Siemens PLM Software for electronic cooling | en |
| dc.type | článek | cs |
| dc.type | article | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
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