Reusing SMD Components on E-textiles: An Ageing Study by Combination of Corrosive Gases and Washing

Abstract

The growing demand for sustainable practices in the electronics industry has led to the exploration of circular economy principles, particularly in e-textiles. This study investigates the feasibility of reusing surface-mount device (SMD) components integrated into conductive textile ribbons under conditions simulating real-life degradation. Using accelerated aging tests involving exposure to corrosive gases and washing cycles, we evaluated the durability of electrical connections and conductive paths. Results show that SMD components can be reused across multiple life cycles with minimal performance loss, while conductive ribbons exhibit degradation primarily during washing. Protective measures, such as seam-sealing adhesive tape, were effective against environmental pollutants but less so against detergent infiltration during washing. A novel remanufacturing process was employed to extract, clean, and reattach SMD components, demonstrating their viability for reuse without compromising quality. This research highlights the potential for sustainable etextile manufacturing by enabling component reuse and reducing electronic waste.