The increasing importance of the thermal management for modern electronic packages
| dc.contributor.author | Psota, Boleslav | |
| dc.contributor.author | Szendiuch, Ivan | |
| dc.contributor.editor | Pihera, Josef | |
| dc.contributor.editor | Steiner, František | |
| dc.date.accessioned | 2013-01-31T14:13:11Z | |
| dc.date.available | 2013-01-31T14:13:11Z | |
| dc.date.issued | 2012 | |
| dc.description.abstract-translated | This paper deals with the significance of the thermal management for some modern types of electronic packages. The main part is focused on the Quad-Flat No-leads (QFN) package and its mounting ways and means, which depends significantly on their thermal characteristic. Apart from that, thermal properties of the Ball Grid Array (BGA) package were also calculated as well as thermal resistances for each structure. All results were gained through the computer simulations, which were done in ANSYS program. | en |
| dc.format | 5 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | Electroscope. 2012, č. 6, EDS 2012. | cs |
| dc.identifier.issn | 1802-4564 | |
| dc.identifier.uri | http://hdl.handle.net/11025/1047 | |
| dc.language.iso | en | en |
| dc.publisher | Západočeská univerzita v Plzni, Fakulta elektrotechnická | cs |
| dc.relation.ispartofseries | Electroscope | cs |
| dc.rights | © 2012 Electroscope. All rights reserved. | en |
| dc.rights.access | openAccess | en |
| dc.subject | teplotní management | cs |
| dc.subject | elektronické pakety | cs |
| dc.subject.translated | electronic packages | en |
| dc.subject.translated | thermal management | en |
| dc.title | The increasing importance of the thermal management for modern electronic packages | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
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