Vplyv okolitej teploty na elektrickú pevnosť elektricky izolovanej tepelnej trubice

Abstract

At present, the volume concentration of electronic components in their miniaturization to different types of microchips and increasing their performance raises the problem of cooling such elements due to the increasing density of heat flow of heat loss. Compliance with safe operating temperature of active semiconductor element is very closely related to the reliability and durability not only components, but also the entire device. Often it is also necessary to electrically isolate the unit from the side of the cooler air. Cooling demand by natural convection is typical for applications with high operating reliability. To the reliability of the system for removing heat loss increased, it is necessary to minimize need to use the mechanically or electrically powered elements, such as circulation pumps or fans. Experience to date with applications of heat pipe in specific systems appears to b e the most appropriate method of cooling. Heat pipes are most often made of metallic materials, and thus, are electrically conductive. The task of the experiment was to find out what is the effect on the ambient temperature vigorousness electricity using a heat pipe. Heat pipe must be evaporatin g part and condensation part a separate non - conductive material. A necessary condition was also the use of working fluid, which is also electrically non - conductive. For this experiment was used Fluorinert FC - 72 is clear, colorless , liquid fully fluoridated . Like other fluorinertné liquid FC - 72 is thermally and chemically stable, compatible with metals and plastics, non - flammable, virtually non - toxic. This unique combination of properties makes the FC - 72 ideal for many electronic applications, because it is also an excellent insulator. Use should be restricted to closed systems because fluorinated fluids have very high global warming potential and longevity in the atmosphere.