Adheze a pájitelnost TPC substrátů v závislosti na koncentraci kyslíku ve vypalovacím procesu
| dc.contributor.author | Hlína, Jiří | |
| dc.contributor.author | Řeboun, Jan | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.contributor.editor | Fiřt, Jaroslav | |
| dc.date.accessioned | 2017-11-13T10:23:49Z | |
| dc.date.available | 2017-11-13T10:23:49Z | |
| dc.date.issued | 2016 | |
| dc.description.abstract-translated | This paper is focused on an adhesion and solderability measuring of samples prepared by TPC (Thick Printed Copper) technology. The TPC technology is used for power electronic substrate manufacturing. Copper film is screen printed on alumina substrate and fired in nitrogen atmosphere. Oxygen level dependence on adhesion of copper film to alumina base and copper film solderability was observed in the paper. | en |
| dc.format | 4 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | FIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 3.-4. listopadu 2016. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2016, s. [70-74]. | cs |
| dc.identifier.isbn | 978–80–261–0516–9 | |
| dc.identifier.uri | http://hdl.handle.net/11025/26507 | |
| dc.language.iso | cs | cs |
| dc.publisher | Západočeská univerzita v Plzni | cs |
| dc.rights | © Západočeská univerzita v Plzni | cs |
| dc.rights.access | openAccess | en |
| dc.subject | tlustý film | cs |
| dc.subject | měď | cs |
| dc.subject | oxid hlinitý | cs |
| dc.subject | adheze | cs |
| dc.subject | pájitelnost | cs |
| dc.subject.translated | thick film | en |
| dc.subject.translated | copper | en |
| dc.subject.translated | alumina | en |
| dc.subject.translated | adhesion | en |
| dc.subject.translated | solderability | en |
| dc.title | Adheze a pájitelnost TPC substrátů v závislosti na koncentraci kyslíku ve vypalovacím procesu | cs |
| dc.title.alternative | Adhesion and solderability of TPC substrates at different oxygen level in firing process | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | conferenceObject | en |
| dc.type.status | Peer-reviewed | en |
| dc.type.version | publishedVersion | en |
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