A novel laboratory anodic bonding device for MEMS applications

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dc.contributor.authorPekárek, Jan
dc.contributor.authorHáze, Jiří
dc.contributor.authorPavlík, Michal
dc.contributor.authorVrba, Radimír
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2012-11-01T09:30:40Z
dc.date.available2012-11-01T09:30:40Z
dc.date.issued2010
dc.description.abstract-translatedThe article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 °C and by applying an external DC electric field in a range of 500 – 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.en
dc.format3 s.cs
dc.format.mimetypeapplication/pdf
dc.identifier.citationElectroscope. 2010, č. 3, EDS 2010.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://hdl.handle.net/11025/585
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rightsCopyright © 2007-2010 Electroscope. All Rights Reserved.en
dc.rights.accessopenAccessen
dc.subjectanodické lepenícs
dc.subjectaplikace MEMScs
dc.subject.translatedanodic bondingen
dc.subject.translatedMEMS applicationsen
dc.titleA novel laboratory anodic bonding device for MEMS applicationsen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.type.statusPeer-revieweden
dc.type.versionpublishedVersionen

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Číslo 3 - EDS 2010 (2010)
Číslo 3 - EDS 2010 (2010)