Visualizing Dynamic Etching in MEMS VR-CAD Tool
Date issued
2006
Authors
Journal Title
Journal ISSN
Volume Title
Publisher
Václav Skala - UNION Agency
Abstract
In this paper we introduce our virtual etching as part of MAGDA a CAD system for Micro Electro Mechanical
Systems (MEMS). Virtual prototyping visualizations require fast algorithms for visualization that are suitable
for interactive design. Modern MEMS simulators do not offer dynamic visualizations for etching. Etching
progress is time dependent, typically calculated with Finite Element Analysis, which has too slow a calculation
time, hence is not suitable for interactive design. Etching progress is important in MEMS with small dimensions,
where Silicon technology must be used, with its repeated cycles of deposition and lithography/etching until the
desired structure is formed. While etching performance is well known from the Integrated Circuit processing, it
is not so predictable in MEMS because the shapes are more complex. Underetching is not desired in IC
technology, but it is crucial in shaping MEMS structures. We use a Marker/String method for the progressive
mesh as a faster method suitable for interactive design. The method is not known much for etching; but used in
other applications. We have found a way of overcoming swallowtail conditions that appear on corners. We are
also able to simulate underetching. In this paper we demonstrate the progress of etching using a circular
lithography mask calculated in 2D then rotated, and a square mask calculated in 3D. In both cases we are able to
simulate underetching. The method can be extended into larger material removal CAD visualizations. In this
way we made a step towards filling a long existing need in virtual prototyping.
Description
Subject(s)
vědecká vizualizace, virtuální realita, CAD, MEMS
Citation
WSCG '2006: Full Papers Proceedings: The 14-th international Conference in Central Europe on Computer Graphics, Visualization and Computer Vision 2006: University of West Bohemia, Plzen, Czech Republic, January 31 – February 2, 2006, p. 343-350.