A Comparative Study of Silver Sintering Pastes for Die-Attach Applications: Microstructure, Mechanical Properties, and Reliability

Abstract

This paper is focused on a comparative study of silver sintering pastes for die-attach applications. Three different silver sintering paste from NBETech, Nano-join and Jufeng were used for the study. The quality and reliability of sintered joints between alumina ceramic substrates with printed silver conductive patterns and ceramic mock-up chips were evaluated. A detailed description of the experiments, boxplot diagrams with measured values of mechanical strength, X-ray scans, SEM images and metallographic cross-sections of all tested samples before and after the thermal shock cycling with analysis and recommendations are described in the paper.