Assembly technology of electronic components for e-textiles

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dc.contributor.authorBlecha, Tomáš
dc.contributor.authorHirman, Martin
dc.contributor.authorNavrátil, Jiří
dc.date.accessioned2025-06-20T08:26:38Z
dc.date.available2025-06-20T08:26:38Z
dc.date.issued2024
dc.date.updated2025-06-20T08:26:38Z
dc.description.abstractThis article deals with the issue of assembling conventional SMD components on textile substrates using UV-curable non-conductive adhesives. This technology is easily applicable in the textile industry. It thus enables the easy and fast production of e-textiles that are equipped with conventional electronic components or even entire electronic modules. The article describes the principle of this innovative technology. Furthermore, comprehensive results of testing the effect of mechanical stress, chemical cleaning, and climatic changes on e-textiles with assembled SMD components on the change in contact resistance are presented here. The results show that this technology can be used for assembling and encapsulating SMD components on a textile substrate in the realization of e-textiles.en
dc.format7
dc.identifier.doi10.1016/j.pedc.2024.100056
dc.identifier.issn2772-3704
dc.identifier.obd43942662
dc.identifier.orcidBlecha, Tomáš 0000-0001-7257-6242
dc.identifier.orcidHirman, Martin 0000-0002-8481-8971
dc.identifier.orcidNavrátil, Jiří 0000-0001-6348-0812
dc.identifier.urihttp://hdl.handle.net/11025/59770
dc.language.isoen
dc.project.IDSGS-2021-003
dc.project.IDFW03010095
dc.relation.ispartofseriesPower Electronic Devices and Components
dc.rights.accessA
dc.subjectE-textileen
dc.subjectnon-conductive adhesiveen
dc.subjectUV-curable adhesiveen
dc.subjectSMD assembly technologyen
dc.subjectcontact resistanceen
dc.titleAssembly technology of electronic components for e-textilesen
dc.typeČlánek v databázi Scopus (Jsc)
dc.typeČLÁNEK
dc.type.statusPublished Version
local.files.count1*
local.files.size5279615*
local.has.filesyes*
local.identifier.eid2-s2.0-85183780293

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