Advanced electronic components and systems for high frequency applications

Abstract

Abstract In recent years, Printed Electronics (PE) technology has gained a lot of attention because of its potential to lower fabrication costs and simplify manufacturing compared to traditional methods. PE technology works by using a one-step printing process, followed by post-curing to activate the functionality of the printed ink. This modern approach is much simpler and more cost-effective than conventional multi-step manufacturing processes, making it an exciting alternative in the field. One of the most compelling advantages of PE technology is its high throughput printing capacity, which positions it as a primary method in modern production environments. This capability allows for rapid, large-scale manufacturing of electronic components, making it an attractive option for industries seeking to improve efficiency and reduce overhead costs. Additionally, the inherent flexibility of PE technology enables the creation of complex electronic circuits on various substrates, paving the way for advancements in diverse applications across production and research fields. This research aims to explore and address the challenges associated with fabricating microwave circuits and components using PE methods. Specifically, this study focuses on different printing technologies, emerging as a viable alternative technology for developing Radio Frequency (RF) components. This research involves a comprehensive comparison of fabrication results obtained through PE methods with simulation responses. The objective is to identify discrepancies, understand the underlying reasons for any differences, and propose solutions to enhance the accuracy and reliability of PE-fabricated RF devices. Through this investigation, the study aims to provide valuable insights into the practical challenges and opportunities associated with integrating PE technology into the fabrication of advanced electronic components. The outcomes of this research are expected to contribute significantly to the field of printed electronics, offering a clearer understanding of the feasibility and limitations of using printing systems for RF device fabrication. This study aims to open new opportunities for creating production methods in the electronics industry that are not only more efficient and cost-effective but also scalable and practical for real-world and high-frequency applications.